- Manufacturer:
-
- Aavid (38)
- Comair Rotron (7)
- CUI Devices (6)
- Wakefield Thermal (11)
- Part Status:
-
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
87 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Aavid | HEAT SINK |
1,500 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
3,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK SMT PKG |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 9.... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 13... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 25... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 19... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 25... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 22... |
1 |
3,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 26... |
1 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK TO-263 12.7... |
1 |
21,650
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEAT SINK COPPER... |
1 |
20,927
In-stock
|
Get Quote |