- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 26... |
1 |
3,000
In-stock
|
Get Quote |
