- Manufacturer：
-
- Aavid (38)
- Comair Rotron (7)
- CUI Devices (6)
- Wakefield Thermal (11)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
87 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO22... |
800 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TIN SOL... |
1 |
5
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK |
6,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote |
