- Manufacturer：
-
- Aavid (4)
- Comair Rotron (2)
- CUI Devices (1)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK SMT PKG |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 TI... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 TI... |
1 |
5,895
In-stock
|
Get Quote |
