- Manufacturer：
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- Seeed (3)
- Package Cooled：
-
- Attachment Method：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
1,092 |
3,000
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM HEATSIN... |
1 |
43
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1 |
9
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
5,233
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
1 |
31
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
317
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
532
In-stock
|
Get Quote |
