- Manufacturer:
-
- CTS Corporation (229)
- CUI Devices (22)
- Ohmite (10)
- Seeed (3)
- Wakefield Thermal (42)
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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364 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
NTE Electronics, Inc. | CLIP-ON H/S FOR 40P... |
1 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
606 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote |