- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
338
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,178
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X19.5M... |
10 |
3,000
In-stock
|
Get Quote |