- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
818
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
338
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,178
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
731
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MM X 58... |
1 |
293
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X19.5M... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X24.5M... |
10 |
3,000
In-stock
|
Get Quote |
