Welcome to visit our website, our working hours are: Monday to Friday 9:00-18:00.
Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 ...
1,872
RFQ
3,000
In-stock
Get Quote
960-19-12-F-AB-0 Wakefield Thermal
HEATSINK 19X12MM F...
1
RFQ
3,000
In-stock
Get Quote
960-19-12-S-AB-0 Wakefield Thermal
HEATSINK 19X12MM S...
1
RFQ
175
In-stock
Get Quote
960-19-12-D-AB-0 Wakefield Thermal
HEATSINK 19X12MM D...
1
RFQ
111
In-stock
Get Quote
1 / 1 Page, 4 Records