Product overview
- Product number
- HSB07-202009
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, BGA, 20 X 20 X 9 MM
Documents and media
- Datasheets
- HSB07-202009
Product Details
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 24.08°C/W
- Type :
- Top Mount
product description
HEAT SINK, BGA, 20 X 20 X 9 MM
Purchases and prices
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