- Manufacturer:
-
- Aavid (21)
- Seeed (6)
- T-Global Technology (23)
- Wakefield Thermal (14)
- Part Status:
-
- Type:
-
- Shape:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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75 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
T-Global Technology | PH3 101.6X38.1X0.21MM |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 50.8X12.07X... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X12.07X... |
6 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 101.6X25.4X... |
3 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X25.4X0... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 101.6X38.1X... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X25.4X0... |
4 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 101.6X25.4X... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 222X165X0.21MM W/A... |
1 |
3,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N 100X100X0.07MM W/... |
1 |
3,000
In-stock
|
Get Quote | |||
Seeed | HEAT SINK FOR CUB... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR BGA... |
1,200 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CPU 25MM... |
1,200 |
3,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | HEAT SINK SFP DWD... |
2 |
372
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 19832 PROF... |
1 |
25
In-stock
|
Get Quote | |||
Aavid | 60340 EXTRUSION 1.312... |
1 |
6
In-stock
|
Get Quote | |||
Aavid | 65445 EXTRUSION 1.312... |
1 |
2
In-stock
|
Get Quote | |||
Aavid | 62725 EXTRUSION 2.28X... |
1 |
14
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 19275 PROF... |
1 |
16
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXFLOW HEAT SIN... |
1,000 |
3,000
In-stock
|
Get Quote |