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Product overview

Product number
PH3N-76.2-25.4-0.07-1A
Manufacturer
T-Global Technology
Catalog
Thermal - Heat Sinks
product description
PH3N NANO 76.2X25.4X0.07MM

Documents and media

Product Details

Attachment Method :
Adhesive
Diameter :
-
Material :
Copper
Material Finish :
Polyester
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Obsolete
Power Dissipation @ Temperature Rise :
-
Shape :
Rectangular
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Heat Spreader

product description

PH3N NANO 76.2X25.4X0.07MM

Purchases and prices

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