- Manufacturer：
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- Aavid (4)
- CUI Devices (2)
- Ohmite (8)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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24 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | TO-263 SMD HEAT SIN... |
200 |
2,600
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 12.7... |
1 |
885
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 19.3... |
1 |
982
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
71
In-stock
|
Get Quote |
