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Product overview

Product number
V-1102-SMD/A-L
Manufacturer
ASSMANN WSW Components
Catalog
Thermal - Heat Sinks
product description
HEATSINK TO-263 19.38X25.40MM

Documents and media

Datasheets
V-1102-SMD/A-L

Product Details

Attachment Method :
SMD Pad
Diameter :
-
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-263 (D²Pak)
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
23.00°C/W @ 300 LFM
Thermal Resistance @ Natural :
11.00°C/W
Type :
Top Mount

product description

HEATSINK TO-263 19.38X25.40MM

Purchases and prices

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