- Manufacturer：
-
- Aavid (4)
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (14)
- Part Status：
-
- Material：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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33 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-263 (D2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | TOP MOUNT HEATSI... |
1 |
3,848
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
556
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
537
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
111
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
200 |
2,600
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 12.7... |
1 |
885
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 19.3... |
1 |
982
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
71
In-stock
|
Get Quote |
