- Material：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
23 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
3,672 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
3,872 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1,872 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1,280 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
543
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
54
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,178
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
2,354
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,039
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,582
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,588
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,741
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,798
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
932
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,212
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
696
In-stock
|
Get Quote |
