- Manufacturer：
-
- Aavid (13)
- CTS Corporation (2)
- CUI Devices (14)
- DFRobot (3)
- Enclustra (2)
- Seeed (5)
- T-Global Technology (18)
- TechNexion (1)
- Trenz Electronic (2)
- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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69 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK PRESSON... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | .5X.25X.34 HEATSINK ... |
100 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
DFRobot | PURE COPPER HEAT... |
1 |
115
In-stock
|
Get Quote | ||
|
|
Aavid | HTSK-AL-PF750 REV A... |
1 |
703
In-stock
|
Get Quote | ||
|
|
Aavid | 60340 EXTRUSION 1.312... |
1 |
6
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
1 |
751
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
230
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
219
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
199
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
188
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
53
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
35
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
100
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 LO... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
14
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 VE... |
1 |
12,640
In-stock
|
Get Quote | ||
|
|
Aavid | MRP/PF-720 |
1 |
1,580
In-stock
|
Get Quote |
