- Manufacturer：
-
- Aavid (7)
- CTS Corporation (1)
- CUI Devices (11)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
21 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | HEATSINK TO-202 CL... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-202 CL... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
6,750 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 LO... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 VE... |
1 |
12,640
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,949
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,919
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,336
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
5,013
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,424
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,297
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,745
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,991
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,405
In-stock
|
Get Quote |
