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Product overview

Product number
APF30-30-06CB
Manufacturer
CTS Corporation
Catalog
Thermal - Heat Sinks
product description
HEATSINK LOW-PROFILE FORGED

Documents and media

Datasheets
APF30-30-06CB

Product Details

Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
4.40°C/W @ 200 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount

product description

HEATSINK LOW-PROFILE FORGED

Purchases and prices

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