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Product overview

Product number
655-53AB
Manufacturer
Wakefield Thermal
Catalog
Thermal - Heat Sinks
product description
HEATSINK CPU 40.6MM SQ H=.525"

Documents and media

Datasheets
655-53AB

Product Details

Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Active
Power Dissipation @ Temperature Rise :
4.0W @ 40°C
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
2.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount

product description

HEATSINK CPU 40.6MM SQ H=.525"

Purchases and prices

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