TC1-20G - Chip Quik, Inc. - TeamGene

TC1-20G

Product overview

Product number: TC1-20G

Manufacturer: Chip Quik, Inc.

Catalog: Thermal - Adhesives, Epoxies, Greases, Pastes

product description: HEAT SINK COMPOUND - HIGH DENSIT

Documents and media

Datasheets: TC1-20G

Product Details

Color :: White

Features :: -

Part Status :: Active

Shelf Life :: 60 Months

Size / Dimension :: 20 gram Syringe

Storage/Refrigeration Temperature :: 37°F ~ 77°F (3°C ~ 25°C)

Thermal Conductivity :: 0.67W/m-K

Type :: Silicone Compound

Usable Temperature Range :: -

product description

HEAT SINK COMPOUND - HIGH DENSIT

Purchases and prices

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