Product overview
- Product number
- APF19-19-13CB
- Manufacturer
- CTS Corporation
- Catalog
- Thermal - Heat Sinks
- product description
- HEATSINK LOW-PROFILE FORGED
Documents and media
- Datasheets
- APF19-19-13CB
Product Details
- Attachment Method :
- Thermal Tape, Adhesive (Not Included)
- Diameter :
- -
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.00°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
product description
HEATSINK LOW-PROFILE FORGED
Purchases and prices
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