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Product overview

Product number
HSE-B254-04H
Manufacturer
CUI Devices
Catalog
Thermal - Heat Sinks
product description
HEAT SINK, EXTRUSION, TO-220/TO-

Documents and media

Datasheets
HSE-B254-04H

Product Details

Attachment Method :
PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Part Status :
Active
Power Dissipation @ Temperature Rise :
4.7W @ 75°C
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
4.93°C/W @ 200 LFM
Thermal Resistance @ Natural :
15.96°C/W
Type :
Board Level

product description

HEAT SINK, EXTRUSION, TO-220/TO-

Purchases and prices

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