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Product overview

Product number
2192-6325-9UA-1902
Manufacturer
3M
Catalog
Sockets for ICs, Transistors
product description
TEST BURN-IN PGA

Documents and media

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
30.0µin (0.76µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyethersulfone (PES)
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
192 (25 x 25)
Operating Temperature :
-55°C ~ 150°C
Part Status :
Active
Termination :
Solder
Type :
PGA, ZIF (ZIP)

product description

TEST BURN-IN PGA

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