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Product overview

Product number
824-AG32D
Manufacturer
TE Connectivity AMP Connectors
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 24POS TINLEAD

Documents and media

Datasheets
824-AG32D

Product Details

Contact Finish - Mating :
Tin-Lead
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
80.0µin (2.03µm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Obsolete
Termination :
Solder

product description

CONN IC DIP SOCKET 24POS TINLEAD

Purchases and prices

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