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Product overview

Product number
18-1508-31
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 18POS GOLD

Documents and media

Datasheets
18-1508-31

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
Polyamide (PA46), Nylon 4/6
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Termination :
Wire Wrap

product description

CONN IC DIP SOCKET 18POS GOLD

Purchases and prices

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