Product overview
- Product number
- 808-AG11D-ES-LF
- Manufacturer
- TE Connectivity AMP Connectors
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN IC DIP SOCKET 8POS GOLD
Documents and media
- Datasheets
- 808-AG11D-ES-LF
Product Details
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 20.0µin (0.51µm)
- Contact Finish Thickness - Post :
- 20.0µin (0.51µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Copper
- Features :
- Open Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Operating Temperature :
- -55°C ~ 105°C
- Part Status :
- Obsolete
- Termination :
- Solder
product description
CONN IC DIP SOCKET 8POS GOLD
Purchases and prices
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