Product overview
- Product number
- DILB18P-223TLF
- Manufacturer
- Amphenol Communication Solutions
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN IC DIP SOCKET 18POS TINLEAD
Documents and media
- Datasheets
- DILB18P-223TLF
Product Details
- Contact Finish - Mating :
- Tin-Lead
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 100.0µin (2.54µm)
- Contact Finish Thickness - Post :
- 100.0µin (2.54µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA), Nylon
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Termination :
- Solder
product description
CONN IC DIP SOCKET 18POS TINLEAD
Purchases and prices
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