Documents and media
- Datasheets
- 70-0403-0910
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423 ~ 424°F (217 ~ 218°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE WATER SOLUBLE 500GM
