Product overview
- Product number
- TS991SNL35T3
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- THERMALLY STABLE SOLDER PASTE NC
Documents and media
- Datasheets
- TS991SNL35T3
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 3
- Part Status :
- Active
- Process :
- -
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
THERMALLY STABLE SOLDER PASTE NC
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