- Manufacturer：
-
- CUI Devices (3)
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
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13 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
53
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
35
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
100
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
14
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,970
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,424
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
50
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
88
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
73
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
90
In-stock
|
Get Quote |
