- Manufacturer：
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- Seeed (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | HEATSINK, MDA-EZ |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR STU... |
1 |
241
In-stock
|
Get Quote | ||
|
|
Seeed | ICE TOWER CPU COO... |
1 |
49
In-stock
|
Get Quote | ||
|
|
Seeed | BLINK BLINK ICE T... |
1 |
3
In-stock
|
Get Quote |
