- Part Status：
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- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK D2PAK TO... |
200 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
200 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
3,000
In-stock
|
Get Quote |
