- Manufacturer:
-
- Aavid (65)
- ABB Embedded Power (15)
- Apex Microtechnology (13)
- Comair Rotron (12)
- CTS Corporation (39)
- CUI Devices (59)
- Ohmite (6)
- Sarnikon (13)
- Wakefield Thermal (72)
- WEC (7)
- Part Status:
-
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
390 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEAT SINKS BOARD... |
7,155 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO22... |
10,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO22... |
5,100 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
1,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
4,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DC/DC HA... |
500 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DC/DC HA... |
640 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 4.8W... |
1 |
1
In-stock
|
Get Quote | |||
WEC | HEAT SINK, EXTRUS... |
23 |
426
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote |