- Manufacturer:
-
- CUI Devices (4)
- Ohmite (12)
- Seeed (1)
- Wakefield Thermal (20)
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
43 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,440 |
3,000
In-stock
|
Get Quote | |||
Seeed | ALUMINUM HEATSIN... |
1 |
43
In-stock
|
Get Quote | |||
Ohmite | HEATSINK 3.100" |
1 |
1
In-stock
|
Get Quote | |||
Ohmite | EXTR FLAT BACK 9" ... |
4 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUDE... |
1 |
3,000
In-stock
|
Get Quote |