- Manufacturer:
-
- Aavid (28)
- Comair Rotron (8)
- CUI Devices (3)
- Wakefield Thermal (14)
- Part Status:
-
- Type:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
70 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO22... |
800 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK |
6,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
10,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
5,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
5,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 PW... |
5,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK |
3,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
2,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | HEAT SINK |
1,500 |
3,000
In-stock
|
Get Quote | |||
Apex Microtechnology | HEATSINK SMT |
1 |
3,000
In-stock
|
Get Quote |