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Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 ...
1
RFQ
54
In-stock
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HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 ...
1
RFQ
1,741
In-stock
Get Quote
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