- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 32.5MM HS ASSY ULTE |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote |
