- Manufacturer：
-
- CUI Devices (1)
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.2W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
36
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM F... |
1 |
99
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM S... |
1 |
99
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM D... |
1 |
81
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X14.5M... |
10 |
3,000
In-stock
|
Get Quote |
