- Manufacturer：
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- CUI Devices (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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12 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
102
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM F... |
1 |
248
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,405
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM D... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM S... |
1 |
68
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM S... |
1 |
86
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM F... |
1 |
76
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM D... |
1 |
28
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X24.5M... |
10 |
3,000
In-stock
|
Get Quote |
