- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1,600 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ASSY FO... |
500 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
10 |
3,000
In-stock
|
Get Quote |
