- Manufacturer：
-
- CTS Corporation (1)
- Package Cooled：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
6
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK CPU W/AD... |
1 |
728
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
3,000
In-stock
|
Get Quote |
