- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,745
In-stock
|
Get Quote |
