- Manufacturer：
-
- Aavid (3)
- CTS Corporation (3)
- Ohmite (2)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | ALUMINUM HEATSIN... |
100 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
100 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR W/PI... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
750 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
100
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR W/PI... |
1 |
47
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
15
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | EXTRUSION 300X51.6X... |
1 |
5
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
3,000
In-stock
|
Get Quote |
