- Manufacturer：
-
- CUI Devices (1)
- Ohmite (1)
- Part Status：
-
- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X21X23MM... |
270 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
3,000
In-stock
|
Get Quote |
