- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR W/PI... |
1 |
4,020
In-stock
|
Get Quote |
