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Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Image Part Manufacturer Description MOQ Stock Action
903-23-1-21-2-B-0 Wakefield Thermal
HEAT SINK ELLIP F...
180
RFQ
3,000
In-stock
Get Quote
HS09 Apex Microtechnology
HEATSINK TO3
1
RFQ
3,000
In-stock
Get Quote
902-21-2-15-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN...
540
RFQ
3,000
In-stock
Get Quote
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