- Manufacturer：
-
- Aavid (1)
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (3)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
52
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR DUA... |
1 |
2,706
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1
In-stock
|
Get Quote |
