- Part Status：
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- Material：
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- Shape：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,151
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,566
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-3 H31.7... |
1 |
600
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER T... |
1 |
46
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
275
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
90
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK DUAL FO... |
1 |
58
In-stock
|
Get Quote |
