- Manufacturer：
-
- Aavid (4)
- CUI Devices (1)
- Material：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 TA... |
1 |
10,825
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
198
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-3 BLA... |
1 |
3,313
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK COPPER ... |
1 |
2,197
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
489
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1 |
257
In-stock
|
Get Quote |
